SD PUSH PUSH welding 3.2H 11P port side deck with a tablet from the inner shells JF

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SD PUSH PUSH welding 3.2H 11P port side deck with a tablet from the inner shells JF

Information Name:	SD PUSH PUSH welding 3.2H 11P port side deck with a tablet from the inner shells JF
Published:	2015-05-19
Validity:	3000
Specifications:	HYC26-SD11-004
Quantity:	1.00
Price Description:
Detailed Product Description：	SD since the bomb inside deck welding PIN: 11 Type SD + MMC card read The main material for the phosphor bronze terminals for the LCP plastics (gold-plated or tinned) copper shell (nickel) properties: high temperature (260 ℃ -265 ℃) , easy to weld, conductivity performance, anti-oxidation, wear by salt spray test, vibration test, tin furnace test, plug the test (machine measured 10000, artificial 8000), SGS test. Division I professional production boosted 1.8 SD card connector, SD boosted 1.8 deck the large stock, price concessions, welcomed the consultation.

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